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Taiwan’s TSMC is constructing superior packaging capability in Japan, in line with two sources conversant in the matter, a transfer that will add momentum to Japan’s efforts to reboot its semiconductor trade.
The deliberations are at an early stage, they added, declining to be recognized as the data was not public.
One possibility the chipmaking big is contemplating is bringing its chip-on-wafer-on-substrate (CoWoS) packaging expertise to Japan, in line with one of many sources who was briefed on the matter.
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